Grid nano-indentation as full-field measurements

Full-Field Indentation Damage Measurement Using Digital Image Correlation

A novel approach based on full-field indentation measurements to characterize and quantify the effect of contact in thin plates is presented. The proposed method has been employed to evaluate the indentation damage generated in the presence of bending deformation, resulting from the contact between a thin plate and a rigid sphere. For this purpose, the 3D Digital Image Correlation (3D-DIC) tech...

Full field imaging of isolated metallic nano objects

Indentation measurements on thin films

Thin films have an important part to play in modern technology. It is difficult to characterize the mechanical properties of thin films because the films cannot usually be investigated separately from the substrate. One of the few methods that can be used for such investigations consists in making an indentation in the film by applying an extremely small and accurately controlled force while at...

Instrumentation for Full Field Deformation Measurement with Nano-Second Resolution

Nano-indentation of Copper Thin Films on Silicon Substrates

Indentation methods are finding increasing use in the study of mechanical properties of bulk and thin-film materials over a wide range of size scales (e.g., [1,2]). With the increasing sophistication of instrumented, depth-sensing indentation equipment and of computational methods to model the deformation of materials subjected to indentation, there is growing interest in studying the elastopla...